Hexagonal voids and the formation of micropipes during SiC sublimation growth

Journal of Applied Physics

Volumn 89, Issue 8, 2001, Pages 4625-4630

  Kuhr, Thomas A ^a   Sanchez, Edward K ^a   Skowronski, Marek ^a   Vetter, William M ^b   Dudley, Michael ^b  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b Stony Brook University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035870905     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1355716     Document Type: Article

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