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Volumn , Issue , 2001, Pages 59-66

Are wires plannable?

Author keywords

[No Author keywords available]

Indexed keywords

DATA STORAGE EQUIPMENT; ELECTRIC WIRE; INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS;

EID: 0035788948     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/368640.368707     Document Type: Conference Paper
Times cited : (7)

References (19)
  • 3
    • 0032026510 scopus 로고    scopus 로고
    • A stochastic wire-length distribution for gigaseale integration (GSI) - Part I: Derivation and validation
    • J.A. Davis and V.K. De and J. Meindl, "A Stochastic Wire-Length Distribution for Gigaseale Integration (GSI) - Part I: Derivation and Validation", IEEE Transactions on Electronic Devices, 1998, vol.45, no.3, pp. 580-589.
    • (1998) IEEE Transactions on Electronic Devices , vol.45 , Issue.3 , pp. 580-589
    • Davis, J.A.1    De, V.K.2    Meindl, J.3
  • 4
    • 0018453798 scopus 로고
    • Placement and average interconnection lengths of computer logic
    • April
    • W.E. Donath, "Placement and average interconnection lengths of computer logic" IEEE Transactions on Circuits and Systems, CAS-26, 4, April 1979
    • (1979) IEEE Transactions on Circuits and Systems , vol.CAS-26 , pp. 4
    • Donath, W.E.1
  • 5
    • 0019565820 scopus 로고
    • Wire length distribution for placements of computer logic
    • 3, May
    • W.E. Donath, "Wire length distribution for placements of computer logic", IBM Journal of Research and Development, 25, 3, May 1981, pp. 152-155.
    • (1981) IBM Journal of Research and Development , vol.25 , pp. 152-155
    • Donath, W.E.1
  • 8
  • 12
    • 0030290949 scopus 로고    scopus 로고
    • Performance modeling of the interconnect structure of a three-dimensional integrated risc processor/cache system
    • Part B, 4, November
    • S.A. Kühn, M.B. Kleiner, P. Ramm and W. Weber, "Performance modeling of the interconnect structure of a three-dimensional integrated risc processor/cache system", IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, vol 19, 4, November 1996., pp 719-718
    • (1996) IEEE Transactions on Components, Packaging and Manufacturing Technology , vol.19 , pp. 719-718
    • Kühn, S.A.1    Kleiner, M.B.2    Ramm, P.3    Weber, W.4
  • 14
    • 0029521759 scopus 로고
    • Interconnect capacitances, crosstalk and signal delay in vertically integrated circuits
    • S.A. Kühn, M.B. Kleiner, P.Ramm and W. Weber, "Interconnect capacitances, crosstalk and signal delay in vertically integrated circuits", Proceedings IEDM, 1995, pp 249-252
    • (1995) Proceedings IEDM , pp. 249-252
    • Kühn, S.A.1    Kleiner, M.B.2    Ramm, P.3    Weber, W.4
  • 16
    • 0033699518 scopus 로고    scopus 로고
    • Multiple Si layer ICs: Motivation, performance analysis and design implications
    • June
    • S.J.Souri, e.a., "Multiple Si layer ICs: motivation, performance analysis and design implications" Proceedings DAC2000, June 2000, pp 213-220.
    • (2000) Proceedings DAC2000 , pp. 213-220
    • Souri, S.J.1
  • 17
    • 0034841915 scopus 로고    scopus 로고
    • Homogeneous multiprocessing and the future of silicon design paradigms
    • Hsinchu, Taiwan, April, tbp
    • P. Stravers, J. Hoogerbrugge, "Homogeneous multiprocessing and the future of silicon design paradigms", V lsi-technology systems applications, Hsinchu, Taiwan, April 2001, tbp
    • (2001) V Lsi-Technology Systems Applications
    • Stravers, P.1    Hoogerbrugge, J.2
  • 19
    • 0012905650 scopus 로고    scopus 로고
    • Integrated Circuit Engineering Corporation, Scotsdale, AZ, USA
    • "Status2000: integrated circuit industry report", Integrated Circuit Engineering Corporation, Scotsdale, AZ, USA, 2000
    • (2000) Status2000: Integrated Circuit Industry Report


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.