The adhesion of evaporated copper to dow cyclotene 3022®, determined by microscratch testing

Journal of Adhesion

Volumn 77, Issue 4, 2001, Pages 309-321

  Sadough vanini, A ^a   Yang, D Q ^b   Martinu, L ^b   Sacher, E ^b  

^a AMIRKABIR UNIVERSITY OF TECHNOLOGY   (Iran)

^b ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

Author keywords

Adhesion; Cyclotene; Evaporated Cu; Interfacial reactions; Microscratch testing; Surface modifications

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; EVAPORATION; INTERFACES (MATERIALS); ORGANIC POLYMERS; PEELING; PERMITTIVITY; PLASMA APPLICATIONS; SPUTTER DEPOSITION; SUBSTRATES; SURFACE REACTIONS; SURFACE TESTING; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERFACIAL ADHESION; MICROSCRATCH TESTING;

ADHESION;

EID: 0035760829     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218460108030744     Document Type: Article

References (30)

1. Murarka, S.P., Gutmann, R.J., Kaloyeros, A.E. and Lanford, W.A., Thin Solid Films 236, 257 (1993).
2. Denison, D.R., Barbour, J.C. and Burkhard, J.H., J. Vac. Sci. Technol. A14, 1124 (1996).
3. Auman, B.C., Mater. Res. Soc. Proc. 381, 19 (1995).
4. Carter, K. et al., Mater. Res. Soc. Proc. 381, 79 (1995).
5. Alptekin, A., Sacher, E., Czeremuszkin, G., Martinu, L. and DiRenzo, M., In: Low and High Dielectric Constant Materials: Materials Science, Processing and Reliability Issues, Rathore, H.S., Singh, R., Thakur, R.P.S. and Sun, S.C. Eds. (Electrochemical Society, Pennington, NJ, 1997), p. 58.
6. Labelle, C.B., Gleason, K.K., Limb, S.J. and Burns, A.J., Mater. Res. Soc. Proc. 443, 189 (1997).
7. Poulin, S., Yang, D.-Q., Sacher, E., Hyett, C. and Ellis, T.H., Appl. Surf. Sci. 164, 15 (2000).
8. Schühler, N. and Oelhafen, P., J. Vac. Sci. Technol. A15, 2529 (1997).
9. Shieu, F.S. and Shiao, M.H., J. Adh. Sci. Technol. 12, 19 (1998).
10. Paik, K.W., Cole, A.S., Saia, R.J. and Chera, J.-J., J. Adh. Sci. Technol. 7, 19 (1993) 403.
11. Yang, D.-Q. and Sacher, E., Appl. Surf. Sci. 173, 30 (2001).
12. Valli, J., J. Vac. Sci. Technol. A4, 3007 (1986).
13. Steinmann, P.A. and Hintermann, H.E., J. Vac. Sci. Technol. A7, 2267 (1989).
14. Martinu, L., In: Plasma Processing of Polymers, d'Agostino, R., Favia, P. and Fracassi, F. Eds. (Kluwer, Boston, 1997), p. 247.
15. Hamilton, G.M. and Goodman, L.E., J. Appl. Mech. 33, 371 (1966).
16. Burnett, P.J. and Rickerby, D.S., Thin Solid Films 153, 403 (1987).
17. Laugier, M., J. Mater. Sci. 21, 2269 (1986).
18. Burnett, P.J. and Rickerby, D.S., Thin Solid Films 157, 233 (1988).
19. Bull, S.J. and Rickerby, D.S. Surf. Coatings Technol. 42, 149 (1990).
20. Blees, M.H., Winkelman, G.B., Balkenende, A.R. and den Toonder, J.M.J., Thin Solid Films 359, 1 (2000).
21. Klemberg-Sapieha, J.E., Küttel, O.M., Martinu, L. and Wertheimer, M.R., J. Vac. Sci. Technol. Ag, 2975 (1991).
22. Shi, M.K., Selmani, A., Martinu, L., Sachet, E., Wertheimer, M.R. and Yelon, A., J. Adh. Sci. Technol. 8, 1129 (1994).
23. Klemberg-Sapieha, J.E., Poitras, D., Martinu, L., Yamasaki, N.L.S. and Lantman, C.W., J. Vac. Sci. Technol. A15, 985 (1997).
24. Gerenser, L.J., J. Vac. Sci. Technol. A6, 2897 (1988).
25. Wertheimer, M.R., Martinu, L. and Liston, E.M., In: Handbook of Thin Film Process Technology, Glocker, D. and Shah, M. Eds. (IOP Publishing, Bristol, 1996), Chapter E3.0.
26. Mittal, K.L., J. Vac. Sci. Technol. 13, 19 (1976).
27. Spell, H.L. and Christenson, C.P., TAPPI J. 62, 77 (1979).
28. Yang, D.-Q., Martinu, L., Sacher, E. and Sadough-Vanini, A., Appl. Surf. Sci. 177, 85 (2001).
29. Yang, D.-Q. Sachet, E., Griswold, E.M. and Smith, G., Appl. Surf. Sci. 180, 200 (2001).
30. Yang, D.-Q. and Sacher, E., J. appl. Phys. 90, 4768 (2001).