Argon ion treatment of the Dow Cyclotene 3022 surface and its effect on the adhesion of evaporated copper

Applied Surface Science

Volumn 173, Issue 1-2, 2001, Pages 30-39

  Yang, D Q ^a   Sacher, E ^a  

^a ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; DIELECTRIC MATERIALS; ELECTRIC INSULATING MATERIALS; EVAPORATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PHOTOACOUSTIC SPECTROSCOPY; SPUTTERING; SURFACE TREATMENT;

DOW CYCLOTENE;

SURFACE CHEMISTRY;

EID: 0034830421     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(00)00882-5     Document Type: Article

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