The interactions between In-Sn solders and an electroless Ni-P deposit upon heat treatment

Journal of Materials Science: Materials in Electronics

Volumn 7, Issue 6, 1996, Pages 397-401

  Lin, Kwang Lung ^a   Chen, Chun Jen ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; HEAT TREATMENT; INDIUM ALLOYS; INTERMETALLICS; NICKEL ALLOYS; SOLDERING ALLOYS; THICKNESS MEASUREMENT; X RAY DIFFRACTION ANALYSIS;

ELECTROLESS NICKEL PHOSPHORUS DEPOSIT; INDIUM NICKEL ALLOYS; INDIUM TIN ALLOYS;

CHEMICAL REACTIONS;

EID: 0030382894     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00180776     Document Type: Article

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