Processing and characterization of ultralow-dielectric constant organosilicate

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 6, 2001, Pages 2155-2161

  Yang, Shu ^a   Pai, Janice C H ^a   Pai, Chien Shing ^b   Dabbagh, Gary ^b   Nalamasu, Omkaram ^b   Reichmanis, Elsa ^a   Seputro, Joko ^b   Obeng, Yaw S ^b  

^a LUCENT TECHNOLOGIES   (United States)

^b AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BLOCK COPOLYMERS; CALCINATION; COMPOSITION; CURING; ELECTRIC BREAKDOWN; MECHANICAL PROPERTIES; MOLECULAR WEIGHT; NANOSTRUCTURED MATERIALS; PERMITTIVITY; PHASE SEPARATION; PORE SIZE; THERMAL EFFECTS;

DIELECTRIC BREAKDOWN STRENGTH; HEATING RATES; NANOPOROUS ORGANOSILICATE; POLYMETHYLSILSESQUIOXANE; ULTRALOW DIELECTRIC CONSTANT;

SILICATES;

EID: 0035519149     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1417542     Document Type: Article

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