Porous silica xerogel processing and integration for ULSI applications

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 213-222

  Jin, Changming ^a   List, Scott ^a   Zielinski, Eden ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC BREAKDOWN; ELECTRIC PROPERTIES; INTEGRATED CIRCUIT MANUFACTURE; LEAKAGE CURRENTS; PERMITTIVITY; PERMITTIVITY MEASUREMENT; POROSITY; POROUS MATERIALS; ULSI CIRCUITS;

AUTOMATED THIN FILM DEPOSITION; CAPACITANCE REDUCTION; XEROGEL;

SILICA GEL;

EID: 0032303992     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-213     Document Type: Conference Paper

References (6)