Atomic structure impacts on dielectric and mechanical properties of hydrogen-silsesquioxane during thermal processing

Materials Research Society Symposium - Proceedings

Volumn 565, Issue , 1999, Pages 267-272

  Liu, Youfan ^a   Dall, Fred ^a  

^a DOW CORNING CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALCOHOLS; DEGRADATION; DIELECTRIC PROPERTIES; HYDROGEN BONDS; HYDROGEN INORGANIC COMPOUNDS; MECHANICAL PROPERTIES; SENSITIVITY ANALYSIS; TEMPERATURE;

HYDROGEN SILSESQUIOXANE; SILANOL; SILICON HYDROGEN BOND DEGRADATION; THERMAL PROCESSING;

DIELECTRIC MATERIALS;

EID: 0033297484     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-565-267     Document Type: Article

References (7)

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