Platinum hillocks in Pt/Ti film stacks deposited on thermally oxidized Si substrate

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 40, Issue 10, 2001, Pages 5850-5855

  Soon, Yong Kweon ^a,b   Si, Kyung Choi ^a   Seung, Jin Yeom ^b   Jae, Sung Roh ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Compressive stress; Platinum hillock; Pt Ti electrode stack; SBT capacitor; Thermal stability; Titanium oxidation

Indexed keywords

ANNEALING; CAPACITORS; COMPRESSIVE STRESS; DEPOSITION; GRAIN BOUNDARIES; INTERFACES (MATERIALS); OXIDATION; SCANNING ELECTRON MICROSCOPY; SILICON; THERMODYNAMIC STABILITY; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRODE STACK; PLATINUM HILLOCK; STRESS EVOLUTION;

PLATINUM;

EID: 0035484399     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.40.5850     Document Type: Article

References (14)