Design and testing of a kinematic package supporting a 32 × 32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

Journal of Lightwave Technology

Volumn 19, Issue 10, 2001, Pages 1543-1559

  Ayliffe, Michael H ^c   Rolston, David R ^a,b,d   Chuah, Alan E L ^a,e   Bernier, Eric ^a,g   Michael, Feras S J ^f   Kabal, David ^a   Kirk, Andrew G ^a,e   Plant, David V ^a,e  

^a IEEE

^b OSA ^*

^c Picolight Inc   (United States)

^d FCI Canada   (Canada)

^e MCGILL UNIVERSITY   (Canada)

^f Xanoptix   (United States)

^g NORTEL NETWORKS   (Canada)

Author keywords

Kinematic design; Optical interconnections; Opto electronic device arrays; Packaging

Indexed keywords

CMOS INTEGRATED CIRCUITS; CROSSTALK; DEGREES OF FREEDOM (MECHANICS); FLIP CHIP DEVICES; HEAT RESISTANCE; OPTICAL INTERCONNECTS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR QUANTUM WELLS; THERMOELECTRICITY;

KINEMATIC PACKAGES; THERMOELECTRIC COOLERS;

OPTOELECTRONIC DEVICES;

EID: 0035481823     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/50.956142     Document Type: Article

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