Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

Journal of Optics A: Pure and Applied Optics

Volumn 1, Issue 2, 1999, Pages 267-271

  Ayliffe, M H ^a   Kabal, D ^a   Lacroix, F ^a   Bernier, E ^a   Khurana, P ^a   Kirk, A G ^a   Tooley, F A P ^a   Plant, D V ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; OPTICAL INTERCONNECTS; OPTICAL SYSTEMS; PRINTED CIRCUIT BOARDS; STABILITY; VLSI CIRCUITS;

FREE SPACE OPTICAL INTERCONNECT; OPTOELECTRONIC PACKAGING; OPTOMECHANICS; PASSIVE ALIGNMENT; TWO DIMENSIONAL ARRAYS;

OPTOELECTRONIC DEVICES;

EID: 0033307189     PISSN: 14644258     EISSN: None     Source Type: Journal    
DOI: 10.1088/1464-4258/1/2/029     Document Type: Article

References (7)

1. Tooley F A P 1996 IEEE J. Sel. Top. Quantum Electron. 2 3-13
2. Szymanski T H and Hinton H S 1996 Appl. Opt. 32 1253-68
3. Robertson B 1998 Appl. Opt. 37 2974-84
4. Tummala R R and Rymaszewski E J 1989 Microelectronics Packaging Handbook (New York: Van Nostrand Reinhold) ch 12
5. Venditti M B, Kabal D, Ayliffe M H, Plant D V, Tooley F A P, Richard E, Currie J and SpringThorpe A J 1998 Proc. LEOS Smart Pixels Summer Topical Meeting (Monterey, CA) paper WA8
6. Boisset G C, Robertson B, Hsiao W S, Taghizadeh M R, Simmons J, Song K, Matin M, Thompson D A and Plant D V 1996 IEEE Photonics Technol. Lett. 8 918-20
7. Kirk A G, Brosseau D F, Lacroix F, Bernier E, Ayliffe M H, Robertson B, Tooley F A P and Plant D V 1998 Proc. Optics in Computing (Brugge, Belgium) paper O8