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Volumn 35, Issue 32, 1996, Pages 6365-6368

4 × 4 vertical-cavity surface-emitting laser (VCSEL) and metal-semiconductor-metal (MSM) optical backplane demonstrator system

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); COOLING SYSTEMS; ELECTRONICS PACKAGING; EQUIPMENT TESTING; IMAGING SYSTEMS; PHOTODETECTORS; PRINTED CIRCUIT MANUFACTURE; SEMICONDUCTOR LASERS; THERMOELECTRIC EQUIPMENT;

EID: 0030284250     PISSN: 1559128X     EISSN: 21553165     Source Type: Journal    
DOI: 10.1364/AO.35.006365     Document Type: Article
Times cited : (23)

References (8)
  • 3
    • 0029289004 scopus 로고
    • Three-dimensional board-to-board free-space optical interconnects and their application to the prototype multiprocessor system—COSINE-III
    • T. Sakano, T. Matsumoto, and K. Noguchi, “Three-dimensional board-to-board free-space optical interconnects and their application to the prototype multiprocessor system—COSINE-III,” Appl. Opt. 34, 1815-1822 (1995).
    • (1995) Appl. Opt. , vol.34 , pp. 1815-1822
    • Sakano, T.1    Matsumoto, T.2    Noguchi, K.3
  • 4
    • 0006496042 scopus 로고
    • Free-space optical interconnection technology in parallel processing systems
    • D. Z. Tsang and T. J. Goblick, “Free-space optical interconnection technology in parallel processing systems,” Opt. Eng. 33, 1524-1531 (1994).
    • (1994) Opt. Eng. , vol.33 , pp. 1524-1531
    • Tsang, D.Z.1    Goblick, T.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.