Mechanical properties of thin films and multilayers

Current Opinion in Solid State and Materials Science

Volumn 1, Issue 5, 1996, Pages 679-683

  Spaepen, Frans ^a   Shull, Alison L ^a  

^a HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001754987     PISSN: 13590286     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-0286(96)80051-9     Document Type: Article

References (61)

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30. Evans AG, Hutchinson JW: The thermomechanical integrity of thin films and multilayers. Acta Metall Mater 1995, 43:2507-2530. An authoritative review of failure mechanisms. The appendix gives a clear, concise review of the mechanisms that give rise to intrinsic stresses. The stress exerted by the grain boundaries should be computed using the interface stress rather than the interface energy (see [38] and 'Surface and and interface stresses' section).
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48. Huang H, Spaepen F: Measurement of Young's modulus and Poission's ratio of free-standing Ag/Cu multilayer thin films. Mater Res Soc Symp Proc 1996, 405:501-506. Tensile testing, using the diffraction technique described in [47] for insitu strain measurement.
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54. Embury JD, Hirth JP: On dislocation storage and the mechanical response of fine scale microstructures. Acta Metall Mater 1994, 42:2051-2056.
55. Venkataraman R, Bravman JC: Separation of film thickness and grain boundary strengthening effects in Al thin films on Si. J Mater Res 1992, 7:2040-2048.
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57. Josell D, Spaepen F: Determination of the interfacial tension by zero creep experiments on multilayers. I. Theory; II. Experiment Acta Metall Mater 1993, 41:3007-3027.
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59. ••]
60. Carel R, Thompson CV, Frost HJ: Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin films. Acta Mater 1996, 44:2479.
61. Thompson CV, Carel R: Stress and grain growth in thin films. J Mech Phys Sol 1996, 44:657-673. This is the latest review paper from Thompson's group, which contains many references to their earlier work. This issue of the journal contains papers from a conference on the Mechanics and Physics of Layered and Graded Materials, all of which are of interest.