Demonstration of chip-to-chip propagation of single flux quantum pulses

IEEE Transactions on Applied Superconductivity

Volumn 11, Issue 1 I, 2001, Pages 337-340

  Maezawa, M ^a   Yamamori, H ^a   Shoji, A ^a  

^a ELECTROTECHNICAL LABORATORY   (Japan)

Author keywords

Josephson junction; Multichip module; Rapid single flux quantum; Solder bumped flip chip bonding

Indexed keywords

BIT ERROR RATE; ELECTRIC POTENTIAL; EXTRAPOLATION; FLIP CHIP DEVICES; JOSEPHSON JUNCTION DEVICES; MAGNETIC FLUX; MULTICHIP MODULES; SIGNAL RECEIVERS; SOLDERING; SUBSTRATES; TRANSMITTERS;

JOSEPHSON RECEIVERS; JOSEPHSON TRANSMITTERS; SINGLE FLUX QUANTUM PULSES;

SQUIDS;

EID: 0035268901     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.919351     Document Type: Conference Paper

References (11)

1. Interface circuits for chip-to-chip data transfer at GHz rate
2. Circuit for chip-to-chip transportation of bits from single flux quantum circuits
3. Towards broadband communications between RSFQ chips
4. Novel approach to chip-to-chip communication using a single flux quantum pulse
5. Chip-to-chip communication using a single flux quantum pulse
6. Fabrication and tests of RSFQ-logic-based D/A converter components
7. Robust superconducting die attach process
8. Pulse jitter and timing errors in RSFQ circuits
9. Limitations on HTS single flux quantum logic
10. Temperature-dependent bit-error rate of a clocked superconducting digital circuit