Chip-to-chip communication using a single flux quantum pulse

IEEE Transactions on Applied Superconductivity

Volumn 10, Issue 2, 2000, Pages 1603-1605

  Maezawa, Masaaki ^a   Yamamori, Hirotake ^a   Shoji, Akira ^a  

^a ELECTROTECHNICAL LABORATORY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; JOSEPHSON JUNCTION DEVICES; MAGNETIC FLUX; TRANSMITTERS;

CHIP TO CHIP COMMUNICATION; SINGLE FLUX QUANTUM (SFC) PULSES;

MULTICHIP MODULES;

EID: 0034207484     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.848308     Document Type: Article

References (6)

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2. A. H. Miklich, A. H. Worsham, D. L. Miller, and J. X. Przybysz, "Circuit for chip-to-chip transportation of bits from single flux quantum circuits," IEEE Trans. Appl. Superconduct., vol. 7, pp. 2278-2281, June 1997.
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4. M. Maezawa, H. Yamamori, and A. Shoji, "Novel approach to chip-to-chip communication using a single flux quantum pulse," IEEE Trans. Appl. Superconduct., vol. 9, pp. 4049-4052, June 1999.
5. Available: http://pavel.physics.sunysb.edu/RSFQ/
6. K. E. Yokoyama, G. Akerling, A. D. Smith, and M. Wire, "Robust superconducting die attach process," IEEE Trans. Appl. Superconduct., vol. 7, pp. 2631-2634, June 1997.