Effect of pH and ionic strength on chemical mechanical polishing of tantalum

Electrochemical and Solid-State Letters

Volumn 3, Issue 5, 2000, Pages 232-234

  Ramarajan, S ^a   Li, Y ^a   Hariharaputhiran, M ^a   Her, Y S ^b   Babu, S V ^a,c  

^a Clarkson University   (United States)

^b Ferro Corporation   (United States)

^c CLARKSON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ALUMINA; CHEMICAL POLISHING; ELECTROSTATICS; IONIC STRENGTH; IONIZATION; PARTICLE SIZE ANALYSIS; PARTICLES (PARTICULATE MATTER); PH EFFECTS; SILICA; SLURRIES; WATER;

DEIONIZED WATER; POLISH RATE;

TANTALUM;

EID: 0034188181     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391010     Document Type: Article

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