Process development of fast and sensitive polySiGe microbolometer arrays

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4288, Issue , 2001, Pages 94-99

  De Moor, P ^a   Kavadias, S ^a   Leonov, V ^a   Van Hoof, C ^a  

^a IMEC   (Belgium)

Author keywords

IR detection; Surface micromachining; Uncooled bolometers

Indexed keywords

ARRAYS; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INFRARED DETECTORS; MICROMACHINING; MICROSENSORS; MULTICHIP MODULES; POLYCRYSTALLINE MATERIALS; SEMICONDUCTING SILICON COMPOUNDS; THERMAL CONDUCTIVITY;

MICROBOLOMETER ARRAYS; MONOCRYSTALLINE GERMANIUM; POLYCRYSTALLINE SILICON GERMANIUM; STRUCTURAL STIFFNESS ENHANCEMENT TECHNIQUES;

BOLOMETERS;

EID: 0034875044     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.429397     Document Type: Conference Paper

References (7)

1. Uncooled infrared imaging arrays and systems
2. Monolithic two-dimensional arrays of micromachined microstructures for infrared applications
3. LETI/LIR's uncooled microbolometer development
4. Linear arrays of fast uncooled poly SiGe microbolometers for IR detection
5. Characterization and optimization of infrared polySiGe bolometers
6. The indent-reflow-sealing process technique: A method for the fabrication of sealed cavities for MEMS devices
7. Hermetically-sealed on-chip packaging of MEMS devices