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Volumn , Issue , 2001, Pages 276-280

Reliability study of high-pin-count flip-chip BGA

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; RELIABILITY; SOLDERED JOINTS; STRESSES; THERMAL EXPANSION;

EID: 0034829982     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (14)

References (15)
  • 10
    • 0003596036 scopus 로고    scopus 로고
    • JEDEC Standard, Plastic BGA 1.0, 1.27, 1.5 mm Pitch, No.95-1, MO-151
    • (1997)
  • 12
    • 0003543015 scopus 로고    scopus 로고
    • ANSYS® 5.5, ANSYS, Inc.
    • (1999)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.