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Volumn , Issue , 2001, Pages 276-280
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Reliability study of high-pin-count flip-chip BGA
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
FATIGUE OF MATERIALS;
FINITE ELEMENT METHOD;
FLIP CHIP DEVICES;
RELIABILITY;
SOLDERED JOINTS;
STRESSES;
THERMAL EXPANSION;
ANALYSIS OF VARIANCE;
DESIGN OF EXPERIMENT;
EFFICIENT RELIABILITY ANALYSIS;
FLIP CHIP BALL GRID ARRAY PACKAGES;
HEAT SPREADER;
UNDERFILL DELAMINATION;
ELECTRONICS PACKAGING;
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EID: 0034829982
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (14)
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References (15)
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