Guidelines to select underfills for flip chip on board assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 589-594

  Okura, J H ^a   Darbha, K ^a   Shetty, S ^a   Dasgupta, A ^a   Caers, J F J M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS; VISCOPLASTICITY;

ENERGY PARTITIONING MODEL; UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0032640838     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)