Qualifying flip-chip underfills

Semiconductor International

Volumn 23, Issue 4, 2000, Pages

  Becker, Karl Friedrich ^a,b   Adams, Tom ^a,c  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

^c Fraunhofer Inst Reliability M ^*

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION (CTE); FLIP CHIP UNDERFILLS;

ACOUSTIC IMAGING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE TESTING; STRESS ANALYSIS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION; THERMOANALYSIS;

FLIP CHIP DEVICES;

EID: 6744221218     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (1)

1. Semmens, J-E. and Kessler, L.W., "Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging with Correlative Analysis," Proceedings of the International Reliability Physics Symposium, April 8-10, Denver, Colo., pp. 141-148.