Influence of flux selection and underfill selection on the reliability of flip-chips on FR-4

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 583-588

  Feustel, Frank ^a   Eckebracht, Andrea ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; MASKS; RELIABILITY; SOLDERING; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

FLUX SELECTION; SOLDER MASK; UNDERFILL SELECTION;

ELECTRONICS PACKAGING;

EID: 0032658031     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)