Single wafer cleaning and drying: Particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dry

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue 1, 2000, Pages 157-160

  Lauerhaas, Jeff ^a   Mertens, Paul W ^b   Fyen, Wim ^b   Kenis, Karine ^b   Meuris, Marc ^b   Nicolosi, Tom ^c   Bran, Mario ^c   Fraser, Brian ^c   Franklin, Cole ^c   Wu, Yi ^c   Heyns, Marc ^b  

^a IMEC   (Belgium)

^b Bimec vzw   (Belgium)

^c Verreq Inc   (United States)

Author keywords

Cleaning; Drying; Megasonics; Rotagoni

Indexed keywords

CLEANING; DRYING; HYDROPHILICITY; HYDROPHOBICITY; QUARTZ; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS;

MEGASONIC CLEANING; PARTICLE REMOVALS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034583830     PISSN: 1523553X     EISSN: None     Source Type: Journal    
DOI: 10.1109/ISSM.2000.993638     Document Type: Article

References (22)

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