Copper photocorrosion phenomenon during post CMP cleaning

Electrochemical and Solid-State Letters

Volumn 3, Issue 3, 2000, Pages 156-158

  Beverina, A ^a   Bernard, H ^a   Palleau, J ^b   Torres, J ^b   Tardif, F ^c  

^a STMICROELECTRONICS   (France)

^b ORANGE LABS   (France)

^c CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; CORROSION; CORROSION INHIBITORS; ELECTROCHEMISTRY; ETCHING; HYDROFLUORIC ACID; SECONDARY ION MASS SPECTROMETRY;

BENZOTRIAZOLE ACID; CHEMICAL MECHANICAL POLISHING; CROTONIC ACID; PHOTOCORROSION;

COPPER;

EID: 0034158770     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390987     Document Type: Article

References (7)

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