Noncontact megasonics for post-Cu CM P cleaning

Solid State Technology

Volumn 43, Issue 7, 2000, Pages 105-114

  Fraser, Brian ^a   Rafie, Sana ^b   Eissa, Mona ^a   Joshi, Somit ^b  

^a Verteq Inc   (United States)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING; CONTAMINATION; POLISHING; SEMICONDUCTOR DEVICE MANUFACTURE;

BRUSH SCRUBBERS; CHEMICAL MECHANICAL PLANARIZATION; MEGASONICS; SLURRY REMOVAL;

COPPER;

EID: 0034228973     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (12)

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4. G. Willits, et al., Semiconductor Fabtech, 10,301,1999.
5. M. Olesen, et al., CMP-MIC Conf. Proc., 5,530,2000.
6. A. Busnaina, T. Kuehn, private communication.
7. Halpern,J. Electrochem. Soc., 421,1953.
8. L. Zhang, et al.,'J. Electrochem. Soc., 146,1442,1999.
9. H. Li, et al., Micro, March 1999.
10. U.S Patent 5,656,097.
11. U.S. Patent 6,039,059.
12. M. Eissa, et al., Post Copper CMP Cleaning: A Noncontact Megasonic Method in Chemical Mechanical Polishing in 1C Device Manufacturing III," R. L. Opila et al, eds., Electrochem. Sac. Proc., PV 99-37, p. 499,2000.