Thermal fatigue resistance evaluation of solder joints in IGBT power modules for traction applications

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 3, Issue , 2000, Pages 1285-1290

  Thebaud, J M ^a   Woirgard, E ^a   Zardini, C ^a   Sommer, K H ^b  

^a UNIVERSITÉ DE BORDEAUX   (France)

^b INFINEON (EUPEC   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

THERMAL FATIGUE RESISTANCES;

CRACK PROPAGATION; FATIGUE OF MATERIALS; HEAT RESISTANCE; INSULATED GATE BIPOLAR TRANSISTORS; METALLIZING; SHEAR STRESS; SOLDERED JOINTS; SOLDERING ALLOYS; STRENGTH OF MATERIALS; SUBSTRATES;

BIPOLAR TRANSISTORS;

EID: 0034472251     PISSN: 02759306     EISSN: None     Source Type: Journal    
DOI: 10.1109/PESC.2000.880495     Document Type: Article

References (16)

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