Substrate-to-base solder joint reliability in high power IGBT modules

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1719-1722

  Herr, E ^a   Frey, T ^a   Schlegel, R ^a   Stuck, A ^b   Zehringer, R ^b  

^a ABB SWITZERLAND LTD   (Switzerland)

^b ABB CORPORATE RESEARCH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; BIPOLAR TRANSISTORS; COPPER; IMAGING TECHNIQUES; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTOR DEVICE TESTING; THERMAL CYCLING;

ALUMINUM NITRIDE; SOLDER JOINT RELIABILITY;

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0031246424     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00147-9     Document Type: Article

References (2)

1. T. Stockmeier, R. Bayerer, D. Sinerius, E. Herr, U. Thiemann, "Reliable 1200 A, 2500 V IGBT Modules for Traction Applications," IEE Colloquium on IGBT Propulsion Drives, London, 1995.
2. Y.-H. Pao, W. Jung, R. Cooper, V. A. Sankaran, and X. Xu, "Thermal Fatigue Modeling of Solder Interlayer in Power Electronics," ASME Advances in Electronic Packaging, EEP-Vol. 10-2, pp. 1059-1068, 1995.