Al/SiC baseplate hybrid power modules: Evaluation of the thermomechanical performances

IWIPP 1998 Proceedings - IEEE International Workshop on Integrated Power Packaging

Volumn , Issue , 1998, Pages 74-78

  Azzopardi, S ^a   Thebaud J M ^a   Worigard, E ^a   Zardini, C ^a   Sable P ^b  

^a UNIVERSITÉ BORDEAUX 1   (France)

^b Advanced Power Technology Europe   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC POWER SYSTEMS;

AL/SIC-MMC; BASE PLATES; CERAMIC SUBSTRATES; DIRECT BONDED COPPERS; HYBRID POWER; SEM OBSERVATION; SOLDER JOINTS; THERMO-MECHANICAL PERFORMANCE;

METALLIC MATRIX COMPOSITES;

EID: 85013236113     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IWIPP.1998.722311     Document Type: Conference Paper

References (5)

1. D.R White, S.D. Keck "New Sic/Al Baseplates for High Perfomurnce Power Modules", Proc. of the 29th PCIM Conference, pp. 341-346, 1996
2. G.L. Romero, J.M Fusaro, J.L. Martinez, "Metal Matrix Composite Power Modules: Improvements in Reliability and Package Integration", Proc. of the 30th IAS Conference, pp. 916-922, 1995.
3. A.J. Yerman, J.F. Burgess, R.O. Carlson, C.A. Neugebauer, "Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor Packagmg", IEEE Trans. on Components, Hybrids and Manufacturing Technology, vol. 6, no. 6. December 1983.
4. W. Wu, M. Held, P. Jacob, P. Scacco, A. Birolini, "Thermal Stress Related Packaging Failure in Power IGBT Modules", Proc. of the 5th ISPSD Symposium, pp. 330-334, 1995.
5. S. Azzopardi, J.-M. Thébaud, E. Wokgad, C. Zardini, "Hybrid Power Modules Using a Metal Matrix Composite Baseplate: An Evaluation", Proc. of the 2nd IEMT/IMC Symposium pp. 173-178, 1998.