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Volumn 445, Issue , 1997, Pages 191-196
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Reliability improvement of aluminum wirebonds in high-power IGBT modules
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
ANNEALING;
BIPOLAR TRANSISTORS;
CRACK INITIATION;
CRACK PROPAGATION;
FATIGUE TESTING;
GRAIN SIZE AND SHAPE;
METALLIZING;
POWER ELECTRONICS;
SCANNING ELECTRON MICROSCOPY;
SHEAR STRENGTH;
THERMAL CYCLING;
INSULATED GATE BIPOLAR TRANSISTORS (IGBT);
WIREBONDING;
INSULATED WIRE;
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EID: 0031386352
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (5)
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References (5)
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