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Volumn 44, Issue 11, 2000, Pages 2089-2091

Modeling short channel effect on high-k and stacked-gate MOSFETs

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC MATERIALS; SEMICONDUCTOR DEVICE MODELS; SURFACE ROUGHNESS; THRESHOLD VOLTAGE;

EID: 0034320816     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(00)00152-0     Document Type: Article
Times cited : (20)

References (10)
  • 1
    • 0032272375 scopus 로고    scopus 로고
    • Ultra-thin gate oxides - performance and reliability
    • Iwai H, Momose HS. Ultra-thin gate oxides - performance and reliability. IEDM'98, 1998.
    • (1998) IEDM'98
  • 2
    • 0032628950 scopus 로고    scopus 로고
    • The incredible shrinking transistor
    • Taur Y. The incredible shrinking transistor. IEEE Spectrum 1999;7:25-9.
    • (1999) IEEE Spectrum , vol.7 , pp. 25-29
    • Taur, Y.1
  • 5
    • 0000010540 scopus 로고    scopus 로고
    • Reactionannealing pathways for forming ultrathin silicon nitride films for composite oxide nitride gate dielectrics with nitrided crystalline silicon-dielectric interfaces for application in advanced complementary MOS devices
    • Lucovsky G. Reactionannealing pathways for forming ultrathin silicon nitride films for composite oxide nitride gate dielectrics with nitrided crystalline silicon-dielectric interfaces for application in advanced complementary MOS devices. J Vac Sci Technol A. 17(4):1999;1340.
    • (1999) J Vac Sci Technol a , vol.17 , Issue.4 , pp. 1340
    • Lucovsky, G.1
  • 6
    • 0032024519 scopus 로고    scopus 로고
    • Making silicon nitride film a viable gate dielectric
    • Ma T.P. Making silicon nitride film a viable gate dielectric. IEEE Trans Electron Dev. 45(3):1998;680.
    • (1998) IEEE Trans Electron Dev , vol.45 , Issue.3 , pp. 680
    • Ma, T.P.1
  • 8
    • 0031144288 scopus 로고    scopus 로고
    • Preventing boron penetration through 25-A gate oxides with nitrgen implant in the Si substrates
    • Liu CT, Ma Y, Luftman H, Hillenius SJ. Preventing boron penetration through 25-A gate oxides with nitrgen implant in the Si substrates. IEEE Elec Dev Lett 1997;18(5):212.
    • (1997) IEEE Elec Dev Lett , vol.18 , Issue.5 , pp. 212
    • Liu, C.T.1    Ma, Y.2    Luftman, H.3    Hillenius, S.J.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.