Effect of solder reflow temperature profile on plastic package delamination

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 105-111

  Huang, Y E ^a   Hagen, D ^a   Dody, G ^a   Burnette, T ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; ELECTRONICS PACKAGING; INDUSTRIAL ELECTRONICS; MOISTURE; SOLDERED JOINTS; SOLDERING; TEMPERATURE CONTROL;

INTEGRATED CIRCUIT PACKAGE; INTERFACIAL INTEGRITY; MATERIAL COMPATIBILITY; MOISTURE PRECONDITIONING; PACKAGE RELIABILITY; PLASTIC BALL GRID ARRAYS; SCANNING ACOUSTIC MICROSCOPY; TEMPERATURE PROFILES;

FAILURE (MECHANICAL);

EID: 84962705193     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731047     Document Type: Conference Paper

References (5)

1. Beddingfield, C, Higgins, L., 1996, "Moisture Sensitivity and Component Reliability of Flip Chip PBGA Assemblies, " IEPS proceedings of technical conference, pp. 26-26.
2. Munamarty, R., McCluskey, P., 1996, "Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages, " Solder & Surface Mount Technology, Iss: 22, pp. 46-50.
3. Ganesan, G., Berg, H., 1993, "Model and Analyses for Solder Reflow Cracking Phenomenon in SMT Plastic Packages. " ECTC IEEE/CHMT Journal
4. Tummala, R., 1989, Micorelectronics Packaging Handbook.
5. Hwang, J., 1996, Modern Solder Technology for Competitive Electronics Manufacturing.