Influence of process variables on the reliability of microBGATM package assemblies

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 518-524

  Partridge, J ^a   Boysan, P ^b   Surratt, B ^b   Foehringer, D ^b  

^a XeTel Corp   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FINISHING; FLASH MEMORY; NETWORK COMPONENTS; OPTIMIZATION; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; DATA STORAGE EQUIPMENT; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; RELIABILITY; THERMAL CYCLING;

ACCELERATED THERMAL CYCLING; PRINTING TECHNOLOGIES; PROCESS VARIABLES; PRODUCT PERFORMANCE; RELIABILITY TEST; SURFACE FINISHES; SURFACE MOUNT ASSEMBLY; THIN SMALL OUTLINE PACKAGES;

ASSEMBLY; ELECTRONICS PACKAGING;

CHIP SCALE PACKAGES (CSP); FLASH MEMORIES;

EID: 0031619643     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678742     Document Type: Conference Paper

References (8)

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