Impact properties of PBGA assemblies reflowed in nitrogen ambient and compressed air

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 3, 2000, Pages 421-425

  Wu, Y P ^b   Chan, Yan C ^a,b  

^a IEEE   (Hong Kong)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Brittleness; Impact test; Nitrogen ambient; PBGA; Reflow

Indexed keywords

BRITTLENESS; CRACKS; IMPACT TESTING; IMPURITIES; INTERFACES (MATERIALS); INTERMETALLICS; NITROGEN; PLASTIC FLOW; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS;

DEFECT DENSITY; NITROGEN AMBIENT; PLASTIC BALL GRID ARRAY;

ELECTRONICS PACKAGING;

EID: 0034238560     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.861556     Document Type: Article

References (5)

1. J. H. Lau and Y. Pao, Eds., Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. New York: McGraw-Hill, 1997.
2. J. H. Lau, "Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibration conditions," in Proc. Jpn. Int. Electron. Manufact. Technol. Symp., Dec. 1995, pp. 13-19.
3. Y. P. Wu, Y. C. Chan, and J. K. L. Lai, "Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient," in Proc. 48th ECTC Conf., Seattle, WA, May, pp. 292-296.
4. H. Hsiao, J. R. Lin, E. K. Chang, and S. M. Adams, Reduction of Solder Defects Under Nitrogen. New York: SMT, Jan. 1998, pp. 56-58.
5. R. W. Hertzberg, Deformation and Fracture Mechanics of Engineering Materials. New York: Wiley, 1996.