Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 292-296

  Wu, Y P ^a   Chan, Y C ^a   Lai, J K L ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSED AIR; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; NETWORK COMPONENTS; NITROGEN; RELIABILITY; SOLDERED JOINTS; SOLDERING; TEMPERATURE; ENVIRONMENTAL TESTING; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; SHEAR STRENGTH;

DIAMETER RATIO; ENVIRONMENTAL STRESS SCREENINGS; MANUFACTURING PROCESS; MECHANICAL SHEAR; NITROGEN AMBIENT; OXYGEN CONTENT; PLASTIC BALL GRID ARRAYS; REPRODUCIBILITIES;

BALL GRID ARRAYS; SOLDERED JOINTS;

PLASTIC BALL GRID ARRAY ASSEMBLIES (PBGA);

EID: 0031629083     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678708     Document Type: Conference Paper

References (7)

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