An avionics guide to uprating of electronic parts

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 3, 2000, Pages 595-599

  Humphrey, David ^a   Condra, Lloyd ^b   Pendsé, Neeraj ^c   Das, Diganta ^d   Wilkinson, Chris ^d   Pecht, Michael G ^d  

^a HONEYWELL   (United States)

^b BOEING COMPANY   (United States)

^c NATIONAL SEMICONDUCTOR CORPORATION   (United States)

^d UNIVERSITY OF MARYLAND   (United States)

Author keywords

Component management; Derating; Parameter conformance; Parameter recharacterization; Parts management; Reliability; Stress balancing; Upgrading; Uprating; Upscreening

Indexed keywords

AVIONICS; SEMICONDUCTOR DEVICE MANUFACTURE; THERMOANALYSIS;

COMPONENT MANAGEMENT; PARAMETER RECHARACTERIZATION; STRESS BALANCING;

ELECTRONICS PACKAGING;

EID: 0034272348     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.868863     Document Type: Article

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