An assessment of the qualified manufacturer list (QML)

IEEE Aerospace and Electronic Systems Magazine

Volumn 12, Issue 7, 1997, Pages 39-42

  Pecht, Michael G ^a   Fink, John ^b   Hakim, Edward ^c   Wyler, John ^d  

^a UNIVERSITY OF MARYLAND   (United States)

^b HONEYWELL   (United States)

^c U S ARMY RESEARCH LABORATORY   (United States)

^d Smiths Industries   (United States)

Author keywords

Best commercial practices; Plastic encapsulated microcircuits; QML

Indexed keywords

MILITARY OPERATIONS; STANDARDS;

PARTS SPECIFICATION; QUALIFIED MANUFACTURER LIST (QML);

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0031185465     PISSN: 08858985     EISSN: None     Source Type: Journal    
DOI: 10.1109/62.596656     Document Type: Article

References (7)

1. Issues Affecting Easy Affordable Access to Leading Electronics Technologies by the US Military and Government, 1996, Pecht, M., Circuit World, Vol. 22, No. 2, pp. 7-15.
2. Reliability Evaluation of Plastic Encapsulated Parts, December 1993, Weil, L., Pecht, M. and Hakim, E., IEEE Trans. on Reliability, Vol. 42, No. 4, pp. 536-540.
3. "The Demise of Plastic Encapsulated Microcircuit Myths," 1994, Proceedings ESREF, E.B. Hakim, R.K. Agarwal and M.G. Pecht, pp. 417-422.
4. Intel, Philips Exiting Military Business, Electronic News, December 23, 1996, pp. 36.
5. Qualified Manufacturers List of Advanced Microcircuits Qualified Under Military Specification MIL-I-38535, QML-38535-4, March 14, 1994.
6. Report of the Defense Science Board on Use of Commercial Components in Military Equipment, June 1989, p. A-18.
7. Memorandum, February 15, 1996, Policy on Incorporating a Performance Based Approach to Reliability in Request for Proposals (RFPs), Assistant Secretary of the Army.