Why a new parts selection and management program?

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 2, 1998, Pages 375-382

  Foucher, Bruno ^a   Kennedy, Rick ^b   Kelkar, Nikhil ^c   Ranade, Yogendra ^d   Govind, Anand ^d   Blake, William ^e   Mathur, Anant ^f   Solomon, Rajeev ^f  

^a Aerospatiale   (France)

^b AlliedSignal Aerospace   (United States)

^c NATIONAL SEMICONDUCTOR CORPORATION   (United States)

^d AGERE SYSTEMS   (United States)

^e NORTHROP GRUMMAN CORPORATION   (United States)

^f UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001481298     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.705487     Document Type: Review

References (24)

1. D. Berry, D. R. Towill, and N. Wadsley, "Supply chain management in the electronics products industry," Int. J. Phys. Distrib. Logist. Manag., vol. 24, no. 10, pp. 20-32, 1994.
2. G. Feigin, "Understanding and modeling supply chain dynamics in the semiconductor industry," Presentation Inst. Syst. Res., Univ. Maryland, College Park, Jan. 1998.
3. D. Yoffie, "CHESS and competing in the age of digital convergence," in Competing in the Age of Digital Convergence, D. Yoffie, Ed. Boston, MA: Harvard Business School Press, 1997.
4. D. Bruner, "Distribution's role redefined by outsourcing, value-added work," Electron. News, Jan. 5, 1998 (At http://www.sumnet. com/enews/DT98/DTStory2.html).
5. R. Liptak and J. Gembicki, "Time to technology and the contact manufacturer," SMT Int. - Asia Pacific Ed., pp. 30-34, Sept./Oct. 1997.
6. SIA, "Turbocharging the U.S. economy," Rep., Mar. 19, 1998.
7. The Economist, "The changing dream," Silicon Valley Surv., p. 19, Mar. 29-Apr. 4, 1997.
8. D. Lammers and R. Wilson, "Intel drags the PC industry to 100-MHz terrain," EE Times, Apr. 10, 1998 (at http://pubs.cmpnet. com/eet/news/98/1003news/intel.html).
9. "The transistor's heir," The Economist, pp. 78-79, Jan. 3, 1998.
10. The National Technology Roadmap for Electronic Interconnects. Lincolnwood, IL: IPC, 1997.
11. The 1996 NEMI Roadmap Washington, DC: NEMI, 1996.
12. C. Harper and H. C. Jones, Active Electronic Component Handbook. New York: McGraw-Hill, 1996.
13. W. Perry, "Specifications and standards - A new way of doing business," Internal Memorandum, U.S. Dept. Defense, June 29, 1994.
14. Ministry of Defense, France, directive CONZE, July 31, 1995.
15. Ministry of Defense, U.K., U.K. defense standards 59-36, issue 5; U.K. defense procurement bulletin, Apr. 1995.
16. M. Pecht, J. Fink, E. Hakim, and J. Wyler, "An assessment of the qualified manufacturer list (QML)," IEEE Aerosp. Electron. Syst. Mag., vol. 12, pp. 39-43, July 1997.
17. National Technology Roadmap San Jose, CA: SIA, 1997.
18. R. G. Daniels, A Participant's Perspective. Los Alamitos, CA: IEEE Computer Soc., Dec. 1996, p. 29.
19. M. Baca, "Obsolescence management in the twenty-first century," in Proc. DMSMS Conf., San Antonio, TX, 1997.
20. Y. Tsukada, "Surface laminar circuit packaging," in Proc. 42nd IEEE-CHMT, 1992, pp. 22-27.
21. Quality semiconductor, Inc., "Quality and reliability, 2nd quarter accumulated test results," Santa Clara, CA, Apr. 1996.
22. S. Brader, "Intrinsic reliability of ABT/LVT in (T)SSOP packages," Logic Products Group, Phillips Semiconduct., COTS Workshop ESREF, Oct. 1997.
23. S. Cohen, "Defense Department to Intel: Stay," Electron. News, Feb. 3, 1997.
24. J. Barrett, "The use of nonmilitary discrete semiconductors and microcircuits in AEGIS," in Proc. DMSMS Conf., San Antonio, TX, 1997.