Temperature dependence of hardness of nanocrystalline copper in low-temperature range

Scripta Materialia

Volumn 37, Issue 7, 1997, Pages 1071-1075

  Huang, Z ^a   Gu, L Y ^a   Weertman, J R ^b  

^a BEIHANG UNIVERSITY   (China)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; CREEP TESTING; DISLOCATIONS (CRYSTALS); GRAIN SIZE AND SHAPE; HARDNESS; LOW TEMPERATURE EFFECTS;

INDENTATION CREEP TESTING;

NANOSTRUCTURED MATERIALS;

EID: 0031258169     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(97)00209-1     Document Type: Article

References (11)

1. A.H. Chokshi, A. Rosen, J. Karch, H. Gleiter, Scripta Metall. 23, 1679 (1989).
2. C. Suryanarayana, D. Mukhopadhyay, S.N. Patankar, F.H. Froes, J. Mater. Res., 7, 2114 (1992).
3. G.E. Fougere, J.R. Weertman, R.W. Siegel, S. Kim, Scripta Metall. et Mater., 26, 1879 (1992).
4. V.G. Gryaznov, V.A. Solov'ev, L.I. Trusov, Scripta Metall. et Mater., 24, 1529 (1990).
5. R.O. Scattergood, C.C. Koch, Scripta Metall, et Mater., 27, 1195 (1992).
6. G. Palumbo, S.J. Thorpe, K.T. Aust, Scripta Metall. et Mater., 24, 1347 (1990).
7. P.G. Sanders, J.R. Weertman, J.G. Barker, R. W. Siegel, Scripta Metall. et Mater., 29, 91 (1993).
8. W.B. Li, J.L. Henshall, R.M. Hooper, K.E. Easterling, Acta Metall. Mater., 39, 3099 (1991).
9. G.W. Nieman, J.R. Weertman, R.W. Siegel, J. Mater. Res., 6, 1012 (1991).
10. J.R. Weertman, Mat. Sci. and Eng., A166, 161 (1993).
11. J. Lian, B. Baudelet, A.A. Nazarov, Mat. Sci. and Eng., A172, 23 (1993).