Analysis of bending of cross sections of tensile tested electrodeposited copper foils

Materials Science and Engineering: A

Volumn 234-236, Issue , 1997, Pages 149-153

  Yang, Jeomshik ^a   Lee, Se Hyeong ^b   Lee, Dong Nyung ^c  

^a Iljin Copper Foil Company Limited   (South Korea)

^b SAMSUNG Electronics   (South Korea)

^c Seoul National University   (South Korea)

Author keywords

Bending of cross section; Copper foil; Tensile test

Indexed keywords

ANISOTROPY; BENDING (DEFORMATION); COPPER; ELECTRODEPOSITION; HARDNESS; INTERFACES (MATERIALS); SUBSTRATES; TENSILE STRENGTH; TENSILE TESTING;

CROSS SECTION BENDING;

METAL FOIL;

EID: 0043237165     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(97)00154-8     Document Type: Article

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