Performance analysis of MCM systems

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 3, 1997, Pages 334-341

  Truzzi, Claudio ^a   Beyne, Eric ^a   Ringoot, Edwin ^a  

^a IMEC   (Belgium)

Author keywords

Lossy lines; MCM; Multchip modules; Signal integrity; Switching noise; System performance; Test

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER AIDED NETWORK ANALYSIS; COMPUTER SIMULATION; COMPUTER SOFTWARE; DIGITAL CIRCUITS; FLIP CHIP DEVICES; SPURIOUS SIGNAL NOISE; THIN FILM DEVICES;

SWITCHING NOISE;

MULTICHIP MODULES;

EID: 0031199963     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.618234     Document Type: Article

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