Evaluation of pentafluoroethane and 1,1-difluoroethane for a dielectric etch application in an inductively coupled plasma etch tool

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 39, Issue 7 B, 2000, Pages 4666-4686

  Karecki, Simon ^a   Chatterjee, Ritwik ^a   Pruette, Laura ^a   Reif, Rafael ^a   Sparks, Terry ^b   Beu, Laurie ^b   Vartanian, Victor ^b  

^a Massachusetts Institute of Technology   (United States)

^b MOTOROLA INC   (United States)

Author keywords

1,1 difluoroethane; FC 125; FC 152a; Fourier transform infrared (FTIR) spectroscopy; Global warming emissions; Hydrofluorocarbon gas; Inductively coupled plasma; Pentafluoroethane; SiO2 etching

Indexed keywords

ASPECT RATIO; DIELECTRIC MATERIALS; FLUOROCARBONS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GAS EMISSIONS; GLOBAL WARMING; PLASMA DENSITY; SILICA;

DIELECTRIC ETCHING; DIFLUOROETHANE; INDUCTIVELY-COUPLED PLASMAS (ICP); PENTAFLUOROETHANE;

PLASMA ETCHING;

EID: 0034228208     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.39.4666     Document Type: Article

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