Use of novel hydrofluorocarbon and iodofluorocarbon chemistries for a high aspect ratio via etch in a high density plasma etch tool

Journal of the Electrochemical Society

Volumn 145, Issue 12, 1998, Pages 4305-4312

  Karecki, Simon ^a   Pruette, Laura ^a   Reif, Rafael ^a   Sparks, Terry ^b   Beu, Laurie ^b   Vartanian, Victor ^b  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ETCHING; FLUOROCARBONS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROCARBONS; MASS SPECTROMETRY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

IODOFLUOROCARBONS; PERFLUOROCOMPOUNDS; QUADRUPOLE MASS SPECTROMETRY;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032288799     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838955     Document Type: Article

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