Large Format Fabrication—A Practical Approach to Low Cost MCM-D

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 18, Issue 1, 1995, Pages 37-41

  White, George ^a   Perfecto, Eric ^a   MeHerron, Dale ^a   DeMercurio, Thomas ^a   Redmond, Thomas ^a   Norcott, Maurice ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

large format; MCM D; multichip modules; photosensitive; polyimides

Indexed keywords

COSTS; DIELECTRIC MATERIALS; ELECTRIC WIRING; ELECTRONIC EQUIPMENT TESTING; ELECTRONICS PACKAGING; ELECTROPLATING; LIGHT SENSITIVE MATERIALS; MICROELECTRONICS; POLYIMIDES; SEMICONDUCTING FILMS; SUBSTRATES;

DICING CHANNELS; ELECTROLYTIC PLATING; LARGE FORMAT FABRICATION; PHOTOSENSITIVE POLYIMIDE; TERMINAL METAL LEVELS;

MULTICHIP MODULES;

EID: 0029244403     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.365480     Document Type: Article

References (6)

1. D. Palmer and W. Worobey, “From display and PWB to MCMs: large panel processing,” in 3rd IEPS/ISHM ICMCM Conf., 1994, pp. 81–85.
2. D. Frye, M. Skinner, R. Heistand, P. Garrou, and T. Tessier, “Cost implications of large area MCM processing,” in 3rd IEPS/ISHM ICMCM Conf., 1994, pp. 69–80.
3. E. Perfecto, K. Prasad, P. Wilkens, G. White, R. Tummala, C. Prasad, and T. Redmond, “Multilevel thin film packaging technology at IBM,” in 2 nd 1EPS/ISHM ICMCM Conf. Proc., Denver, CO, 1993.
4. H. J. Neuhaus, “An MCM-D substrate fabrications model: comparing dry etch, wet etch, and photosensitive dielectrics,” in 2 nd IEPS/ISHM ICMCM Conf. Proc., Denver, CO, 1993.
5. E. Perfecto, D. Berger, C. Osborn, and G. White, “Engineering photosensitive polyimides for MCM-D applications,” Int. J. Microcircuits Electron. Pkg., vol. 16, pp. 319–27, 1993.
6. J. Noren and P. Brofman, “Interconnection considerations for a hybrid MCM,” in 3rd IEPS/ISHM ICMCM Conf, Denver, CO, Apr. 13-15, 1994.