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Volumn 3, Issue , 1998, Pages 1831-1834
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Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
COUPLED CIRCUITS;
ELECTRIC NETWORK ANALYSIS;
ELECTRIC NETWORK SYNTHESIS;
ELECTROMAGNETIC WAVES;
FINITE ELEMENT METHOD;
LOW TEMPERATURE COFIRED CERAMICS (LTCC) PACKAGES;
STRIPLINE CIRCUITS;
ELECTRONICS PACKAGING;
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EID: 0031638396
PISSN: 0149645X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (29)
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References (3)
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