Development of a Plastic Encapsulated Multichip Technology for High Volume, Low Cost Commercial Electronics

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 18, Issue 1, 1995, Pages 59-65

  Fillion, Raymond A ^a   Wojnarowski, Robert J ^a   Gorcyzca, Thomas B ^a   Wildi, Eric J ^a   Cole, Herbert S ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY; ENCAPSULATION; EPOXY RESINS; FABRICATION; INTEGRATED CIRCUITS; PLASTICS MOLDING; STABILITY; THIN FILMS;

EPOXY ENCAPSULANT; HIGH DENSITY INTERCONNECT TECHNOLOGY; NONMILITARY/NONCOMPUTER ELECTRONICS INDUSTRY; PLASTIC ENCAPSULATED MULTICHIP TECHNOLOGY;

MULTICHIP MODULES;

EID: 0029244404     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.365490     Document Type: Article

References (3)

1. R. A. Fillion, “Status and Update on the GE HDI Multichip Module Technology,” in Symp. Proc. DuPont Symp. High Density Interconnect, 1990, p. 5.
2. T. G. Tessier, “Laser processing alternatives for via and through-hole fabrication in supported and free-standing polyimide films,” in Symp. Proc. DuPont Symp. High Density Interconnect, 1993.
3. R. A. Fillion, W. Daum, E. J. Wildi, and E. B. Kaminsky, “Multichip Modules—chips first vs chips last analysis,” in Symp. Proc. 1992 ISHM Int. Symp. Microelectron., 1992, p. 391.