Analysis and performance of BGA interconnects for RF packaging

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 1998, Pages 131-134

  Staiculescu, D ^a   Pham, A ^a   Laskar, J ^a   Consolazio, S ^a   Moghe, S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COST EFFECTIVENESS; ELECTRIC NETWORK ANALYSIS; EQUIVALENT CIRCUITS; INTEGRATED CIRCUIT LAYOUT;

BALL GRID ARRAYS (BGA) INTERCONNECTS; BUMP GEOMETRY; LUMPED ELEMENT MODELS;

ELECTRONICS PACKAGING;

EID: 0031624823     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)