Ball grid arrays: A DC to 31.5 GHz low cost packaging solution for microwave and MM-wave MMICS

Microwave Journal

Volumn 41, Issue 1, 1998, Pages 158-168

  Panicker, M P R ^a   Douriet, D ^a   Hyslop, M S ^a   Greenman, N L ^a  

^a Micro Substrates Corp (MSC)   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC PRODUCTS; COPPER; COST EFFECTIVENESS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MILLIMETER WAVE DEVICES; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE MODELS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THIN FILM CIRCUITS; TUNGSTEN;

BALL GRID ARRAYS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0031695004     PISSN: 01926225     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. M.P.R. Panicker et al., US Patent No. 4,492,076.
2. C.J. Mattie, "Advanced Alumina: A Manufacturing Medium for Microwave Oscillators and Amplifiers," Microwave Journal, Vol. 36, No. 2, February 1993, pp. 64-74.
3. D.M. Mattox, "Film Deposition Using Accelerated Ions," Electrochemical Technology, No. 2, 1964, pp. 295.