Pulsed and continuous wave plasma deposition of amorphous, hydrogenated silicon carbide from SiH4/CH4 plasmas

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 5, 1999, Pages 2475-2484

  McCurdy, Patrick R ^a   Truitt, Jason M ^a   Fisher, Ellen R ^a  

^a Department of Environmental and Radiological Health Sciences   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0033446005     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582105     Document Type: Article

References (67)

1. D. A. Anderson and W. E. Spear, Philos. Mag. 35, l (1977).
2. W. K. Choi, Y. M. Chan, C. H. Ling, Y. Lee, R. Gopalakrishnan, and K. L. Tan, J. Appl. Phys. 77, 827 (1995).
3. J. Bullot and M. P. Schmidt, Phys. States Solidi B 143, 345 (1987).
4. T. Ma, J. Xu, K. Chen, J. Du, J. Li, and X. Huang, Appl. Phys. Lett. 72, 13 (1998).
5. J. Meneve, E. Dekempeneer, W. Wegener, and J. Smeets, Surf. Coat. Technol. 86-87, 617 (1996).
6. D. Kuhman, S. Grammatica, and F. Jansen, Thin Solid Films 177, 253 (1989).
7. M. L. de Oliveira and S. S. Camargo, Jr., J. Appl. Phys. 71, 1531 (1992).
8. W. A. Nevin, H. Yamagishi, and Y. Tawada, J. Appl. Phys. 72, 4989 (1992).
9. A. Chehaidar, R. Carles, A. Zwick, C. Meunier, B. Cros, and J. Durand, J. Non-Cryst. Solids 169, 37 (1994).
10. G. DellaMea, F. Demichelis, C. F. Pirri, P. Rava, V. Rigato, T. Stapinski, and E. Tresso, J. Non-Cryst. Solids 137-138, 95 (1991).
11. P. J. R. Honeybone, J. K. Walters, D. W. Huxley, R. J. Newport, W. S. Howells, J. Tomkinson, and C. Hotham, J. Non-Cryst. Solids 169, 54 (1994).
12. A. H. Mahan, D. L. Williamson, B. P. Nelson, and R. S. Crandall, Sol. Cells 27, 465 (1989).
13. W. Beyer, J. Non-Cryst. Solids 97-98, 1027 (1987).
14. N. M. Mackie, N. F. Dalleska, D. G. Castner, and E. R. Fisher, Chem. Mater. 9, 349 (1997).
15. C. L. Rinsch, X. Chen, V. Panchalingam, R. C. Eberhart, J.-H. Wan, and R. B. Timmons, Langmuir 12, 2995 (1996).
16. C. R. Savage, R. B. Timmons, and J. W. Lin, Structures-Property Relations in Polymers (American Chemical Society, Washington, DC, 1993), p. 745.
17. N. M. Mackie, D. G. Castner, and E. R. Fisher, Langmuir 14, 1227 (1998); N. M. Mackie and E. R. Fisher, Polym. Prepr. (Am. Chem. Soc. Div. Polym. Chem.) 38, 1059 (1997); M. A. Leich, N. M. Mackie, K. L. Williams, and E. R. Fisher, Macromolecules 31, 7618 (1998); A. E. Lefohn, N. M. Mackie, and E. R. Fisher, Plasma Polym. (to be published).
18. N. M. Mackie, D. G. Castner, and E. R. Fisher, Langmuir 14, 1227 (1998); N. M. Mackie and E. R. Fisher, Polym. Prepr. (Am. Chem. Soc. Div. Polym. Chem.) 38, 1059 (1997); M. A. Leich, N. M. Mackie, K. L. Williams, and E. R. Fisher, Macromolecules 31, 7618 (1998); A. E. Lefohn, N. M. Mackie, and E. R. Fisher, Plasma Polym. (to be published).
19. N. M. Mackie, D. G. Castner, and E. R. Fisher, Langmuir 14, 1227 (1998); N. M. Mackie and E. R. Fisher, Polym. Prepr. (Am. Chem. Soc. Div. Polym. Chem.) 38, 1059 (1997); M. A. Leich, N. M. Mackie, K. L. Williams, and E. R. Fisher, Macromolecules 31, 7618 (1998); A. E. Lefohn, N. M. Mackie, and E. R. Fisher, Plasma Polym. (to be published).
20. N. M. Mackie, D. G. Castner, and E. R. Fisher, Langmuir 14, 1227 (1998); N. M. Mackie and E. R. Fisher, Polym. Prepr. (Am. Chem. Soc. Div. Polym. Chem.) 38, 1059 (1997); M. A. Leich, N. M. Mackie, K. L. Williams, and E. R. Fisher, Macromolecules 31, 7618 (1998); A. E. Lefohn, N. M. Mackie, and E. R. Fisher, Plasma Polym. (to be published).
21. H. Yasuda, Plasma Polymerization (Academic, Orlando, FL, 1985).
22. Plasma Depostion, Treatment and Etching of Polymers, edited by R. d'Agostino (Academic Boston, 1990).
23. V. Panchalingam, X. Chen, C. R. Savage, R. B. Timmons. and R. C. Eberhart, J. Appl. Polym. Sci. 54, 123 (1994).
24. K. Hiramatsu, H. Ohnishi, T. Takahama, and K..-I. Yamanishi, J. Vac. Sci. Technol. A 14, 1037 (1996).
25. P. R. McCurdy, J. M. Truit, and E. R. Fisher, J. Electrochem. Soc. 145, 3271 (1998).
26. K. H. A. Bogart, N. F. Dalleska, G. R. Bogart, and E. R. Fisher, J. Vac. Sci. Technol. A 13, 476 (1995).
27. We refer to "substrate bias" as the amount of voltage applied to the substrate by the power supply in these experiments. We have not, how-ever, directly measured the bias on the substrate when the film surface is allowed to float or "self bias" in the plasma. Note also that substrate bias has been shown to directly affect deposition rate and film composition in the deposition of a variety of materials, including insulating layers and polymers (see Ref. 19).
28. J. R. Bottin, P. R. McCurdy, and E. R. Fisher, Rev. Sci. Instrum. 68, 2149 (1997).
29. K. L. Smith and K. M. Black, J. Vac. Sci. Technol. A 2, 744 (1984).
30. H. Wieder, M. Cardona, and C. R. Guamieri, Phys. Status Solidi B 92, 99 (1979).
31. Y. Tawada, K. Ysuge, M. Kondo, H. Okamoto, and Y. Hamakawa, J. Appl. Phys. 53, 5273 (1982).
32. W.-L. Lin, H.-K. Tsai, S.-C. Lee, W.-J. Sah, and W.-J. Tzeng, Appl. Phys. Lett. 51, 2112 (1987).
33. J. Huran, L. Hrubcin, A. P. Kobzev, and J. Liday. Vacuum 47, 1223 (1996).
34. F. Fujimoto et al., Jpn. J. Appl. Phys.. Part 1 23, 810 (1984).
35. F. Demichelis, G. Crovini, C. F. Pirri, and E. Tresso, Philos. Mag. B 68, 329 (1993).
36. J. L. C. Fonseca, D. C. Apperley, and J. P. S. Badyal, Chem. Mater. 5, 1676 (1993).
37. Above ±1 kV arcing occurred between the substrate and the coil or metal fittings to the glass reactor.
38. Both positive and negative biases were applied to the substrates for completeness. although it is generally understood that the plasma always floats more positive than the substrate.
39. The maximum voltage that could be applied to the plates without arcing was ±200 V.
40. Dala in Fig. 9 is shown only for the pulsed plasma deposited film, however, similar results were obtained for the cw system.
41. M. J. Armstrong and R. H. Muller, J. Appl. Phys. 65, 3056 (1989).
42. P. R. McCurdy, Ph.D. Thesis, Colorado State University, 1999.
43. A. Pastol and Y. Catherine, J. Phys. D 23, 799 (1990).
44. K. Yasui, M. Muramoto, and T. Akahane, Jpn. J. Appl. Phys., Part 1 33, 4395 (1994).
45. U. Kortshagen, N. D. Gibson, and J. E. Lawler, J. Phys. D 29, 1224 (1996).
46. H. U. Eckert, Proceedings of the 2nd International Conference on Plasma Chemistry and Technology, edited by H. Boening (Technomic, Lancaster, PA, 1986), p. 171.
47. P. A. Miller, G. A. Hebner, K. E. Greenberg, P. D. Pochan, and B. P. Aragon, J. Res. Natl. Inst. Stand. Technol. 100, 427 (1995).
48. J. Y. Choe, I. P. Herman, and V. M. Donnelly, J. Vac. Sci. Technol. A 15, 3024 (1997).
49. M. P. Schmidt, I. Solomon, H. Tran-quoc, and J. Bullot, J. Non-Cryst. Solids 77/78, 849 (1985).
50. Y. Catherine, G. Turban, and G. Grolleau, Plasma Chem. Plasma Process. 2, 81 (1982).
51. D. M. Bhusari and S. T. Kshirsagar, J. Appl. Phys. 73, 1743 (1993).
52. K. Yamamoto, Y. Ichikawa, N. Fukada, T. Nakayama, and Y. Tawada, Thin Solid Films 173, 253 (1989).
53. H.-K. Tsai, W.-L. Lin, W. J. Sah, and S.-C. Lee, J. Appl. Phys. 64, 1910 (1988).
54. W.-J. Sah, H.-K. Tsai, and S.-C. Lee, Appl. Phys. Lett. 54, 617 (1989).
55. J. Folsch, H. Rubel, and H. Schade, Appl. Phys. Lett. 61, 3029 (1992).
56. W. Beyer, R. Hagar, H. Sehmidbaur, and G. Winterling, Appl. Phys. Lett. 54, 1666 (1989).
57. H. Kojima, H. Toyoda, and H. Sugai, Appl. Phys. Lett. 55, 1292 (1989).
58. H. Toyoda, H. Kojima, and H. Sugai, Appl. Phys. Lett. 54, 1507 (1989).
59. P. Musumeci, R. Reitano, L. Calcagno, F. Roccaforte, A. Makhtari, and M. G. Grimaldi, Philos. Mag. B 76, 323 (1997).
60. W. K. Choi, T. Y. Ong, L. S. Tan, F. C. Loh, and K. L. Tan, J. Appl. Phys. 83, 4968 (1998).
61. K. M. Kramer and M. O. Thompson, J. Appl. Phys. 79, 4118 (1996).
62. K. Yoshii, Y. Suszaki, A. Yakeuchi, K. Yasutake, and H. Kawabe, Thin Solid Films 199, 85 (1991).
63. M. J. Kushner, J. Appl. Phys. 63, 2532 (1988).
64. G. Cicala. P. Capezzuto, G. Bruno, L. Schiavulli, and G. Amato, J. Appl. Phys. 79, 8856 (1996).
65. A. Tabata, S. Fujii, Y. Suzuoki, T. Mizutani, and M. Ieda, J. Phys. D 23, 316 (1990).
66. Y. Katayama, K. Usami, and T. Shimada, Philos. Mag. B 2, 283 (1981).
67. G. Balestrino, M. Marinelli, E. Milani, A. Paoletti, I. Pinter, and A. Tebano, Appl. Phys. Lett. 62, 879 (1993).