A novel low-loss low-crosstalk interconnect for broad-band mixed-signal silicon MMIC's

IEEE Transactions on Microwave Theory and Techniques

Volumn 47, Issue 9 PART 2, 1999, Pages 1830-1835

  Kim, Juno ^a   Qian, Yongxi ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Crosstalk; Insertion loss; Interconnect; Mixedsignal MMIC; Noise isolation; Silicon 1C

Indexed keywords

CMOS INTEGRATED CIRCUITS; CROSSTALK; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; INSERTION LOSSES; INTERCONNECTION NETWORKS; INTERFERENCE SUPPRESSION; MICROPROCESSOR CHIPS; MULTILAYERS; POLYIMIDES; SILICON WAFERS; SUBSTRATES;

MIXED-SIGNAL MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMIC); NOISE ISOLATION; SILICON-METAL-POLYIMIDE STRUCTURES;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0033366319     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.788519     Document Type: Article

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