Line-Loss and size reduction techniques for millimeter-wave rf front-end boards by using a polyimide/alumina-ceramic multilayer configuration

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 12 PART 2, 1997, Pages 2308-2315

  Nakatsugawa, Masashi ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Alumina ceramic; Losses; Millimeter wave technology; Mmic's; Multilayer; Packaging; Polyimide films

Indexed keywords

ALUMINA; CERAMIC MATERIALS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTILAYERS; PASSIVE NETWORKS; POLYIMIDES; SUBSTRATES;

POLYIMIDE FILMS;

MILLIMETER WAVE DEVICES;

EID: 0031340558     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.643834     Document Type: Article

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