Characterization of buried microstrip lines for constructing high-density microwave integrated circuits

IEEE Transactions on Microwave Theory and Techniques

Volumn 44, Issue 6, 1996, Pages 840-847

  Ishikawa, Takahide ^a   Yamashita, Eikichi ^b  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CONDUCTIVE MATERIALS; DIELECTRIC MATERIALS; FINITE DIFFERENCE METHOD; MICROWAVE INTEGRATED CIRCUITS; NUMERICAL ANALYSIS; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES; TIME DOMAIN ANALYSIS;

FINITE DIFFERENCE TIME DOMAIN METHOD; GROUND CONDUCTOR WALLS; MILLIMETER WAVE INTEGRATED CIRCUITS; RECTANGULAR BOUNDARY DIVISION METHOD; STRIP CONDUCTOR; STUB MATCHING CIRCUITS;

MICROSTRIP LINES;

EID: 0030164141     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.506442     Document Type: Article

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